In an atmosphere of incessant pressure to reduce the size of electronic products while maintaining or increasing their functionality, extreme attention is given to every single element of an ...
Taking only those written in the last week, the most popular stories on our website cover stacking packaging for power modules, EC proposals for a European Space Shield, and Molex buying Smiths ...
Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...
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