Abstract: This paper presents a 3D SIP (system in package) design of four-channel power detection and signal amplification. It used HDI(High-Density Interconnect) technology to vertically interconnect ...

The Powder Bed Fusion (PBF) segment is projected to hold a 36.9% revenue share in 2025, making it the most widely adopted ...

BEIJING (Reuters) -A subsidiary of SiCarrier, a Chinese chip equipment maker with close links to Huawei, unveiled two domestically developed software products for semiconductor designs, the latest ...

A new open-source tool is reshaping how engineers design multi-material objects. Charles Wade, a Ph.D. student in the Department of Computer Science at the University of Colorado Boulder, has created ...

Through this partnership, Aptech Ltd. and WOL3D remain committed to building a strong foundation of 3D printing & product design education in India, combining creative expertise with technical ...

Abstract: One of the advantages of 3D IC technology is its ability to integrate different devices such as CMOS, SRAM, and RRAM, or multiple technology nodes of single or different devices onto a ...